laser marking , ocap, semiconductor assembly manufacturing, Laser Groove, Fmea, Spc, work instructions, pre-assembly processes, Wafer Dicing, Control Plan, Process Engineering, Process Specification, Backgrind, Doe

Solidworks, Process Capability Analysis Cp Cpk, Wire Bond Process Development, Root Cause Analysis, Process Validation, Autocad, Technical Report Writing, Machine Programming, Pfmea, Die Bond Process Development, Statistical Process Control SPC, Design of Experiments DOE

manufacturing processes , SAP, Microsoft Office, Jira, Project Engineering, Engineering Drawings, Assembly operations, Manufacturing Engineering, Tooling, MS Project, Mechanical Engineering, Mechanical components, Industrial manufacturing

scientific moulding, RJG or equivalent Scientific Moulding certification, Injection Moulding, Root Cause Analysis

SAP, Microsoft Office, Jira, Project Management, Microsoft Project

SAP, Microsoft Office, Jira, Project management tools, Microsoft Project

Root Cause Analysis, Moldflow analysis, Scientific moulding principles, Process optimisation, Continuous improvement initiatives, Injection moulding process development

Machine Learning, Power Bi, Tableau, Sql, MATLAB, Software Development, Python, Reliability Engineering, Root Cause Analysis, Fmea, Product Quality, Design for reliability, Ai, APQP, Minitab, Iso 9001, Quality Management System, Data Analysis, Statistical Process Control, Mechanical Engineering, Embedded Systems, Design for Six Sigma

scientific moulding, RJG or equivalent Scientific Moulding certification, Injection Moulding, Root Cause Analysis