optical materials , Supply Chain Operations, Supplier Management, Precision Engineering, semiconductor process flows, Root Cause Analysis, 8D problem-solving, Sourcing

3d packaging , process qualification , thermal management , Package Warpage, 2.5D Packaging, Advanced Packaging Process Development, Chiplets, Spc, CoPoS, Semiconductor Manufacturing Processes, Flip Chip Assembly, Manufacturing Engineering, Failure Analysis, Yield Improvement, Reliability Testing, CoWoS, HBM, Equipment Qualification, Alignment Accuracy, Large Die Packaging, Doe, Customer Process Development

ESD - CFD, Java, Qlik Sense, Tableau, Adobe Cs, Microsoft Excel, Python, Rhino, Autodesk CFD, Bim, Grasshopper, Autodesk Autoturn, Daylighting studies, Autocad, Autodesk Revit, Sketchup, Revit Dynamo

SAP, Dashboards, Project Management, PDA apps, Store-level ERP systems, retail systems

Deposition processes, Iso9001, Spc, Thin film metallurgy, 8D, Jmp, Lean Six Sigma, Statistical skills in data analysis, cvd, Minitab, Ion beam deposition, Ellipsometer, Doe, EDX, Sem, X-ray reflectometry, PVD, 5S

Bim, Autocad

semiconductor equipment, Data Analysis, technical support, Continuous Improvement, system-level troubleshooting, design documentation, New Product Introduction, Root Cause Analysis, automation integration

Machine Learning, Artificial Intelligence, Microsoft Office, Excel, Robotic Process Automation, Powerpoint, ERP systems

Microsoft Excel, Autocad, FF E scheduling tools, Adobe Creative Suite, Sketchup

Electrical engineering principles, Autocad, Microstation, Revit