cmp , Etching, process integration, lithography, deposition, Metrology, wafer fabrication, optical microscopy, yield improvement, defect analysis, Sem, root-cause analysis

die-assembly tools, flip-chip bonders, semiconductor wafer packaging, photonics packaging processes, CAD drawing tools, wire bonders

safety compliance , Ms Office, Marine Engineering, Scaffolding, Security Protocols, Painting

Ms Office Applications, Quality Management System, ISO 9001 Internal Auditor

Ms Office, System design involving multiple axes servo pneumatic actuators, Mechanical engineering standards, Low volume manufacturing methods, Stepper and other drive sensing methods

Ms Office, system design involving multiple axes servo pneumatic actuators, stepper and other drive sensing methods, low volume manufacturing methods