Ms Office, Deep high aspect ratio silicon dielectric etches, Python coding, plasma physics, Surface phenomena, Data science basics, Statistical process control and analysis, Dry Etch process development, Plasma chemistry

data preparation , Tensorflow, Machine Learning, Pytorch, Artificial Intelligence, Data Analytics, Python, scikit-learn, model training, Validation, large-scale deployment

uptime , promis , Rms, Ts16949, process matching, Spc, Si-View, Klarity ACE, CIP programs, 8D, Cp, Jmp, ECN, Space, Oee, Doe, TECN, CAS procedures, SPSR, SLDB, DCOP, CPK, mrb

technical direction , High aspect ratio etch development, Performance management, AI-assisted tools and insights, Plasma Dry Etch Technology, Process development

promis , klarity , Rms, Ace, Spc, Si-View, TS16949 Quality Standard, Cp, Jmp, Space, Doe, CAS procedures, CPK, DCOP, metrology tools