Position title : Mechanical Design Engineer / Senior Mechanical Design Engineer
Responsibilities:
- Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.
- Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation.
- Design equipment modules such as: Wafer handling systems Substrate, strip, panel, or glass-panel handling systems Die ejection, die pickup, and die transfer mechanisms Precision XY, XYZ, XYZT, and multi-axis positioning stages Bondheads and thermal bondheads Micro-Z, force-control, compliance, and tip-tilt mechanisms Heating, cooling, vacuum, gas, and thermal isolation structures Conversion kits, change parts, fixtures, tooling, nests, and bond tools
- Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures.
- Conduct tolerance stack-up and design reviews for critical precision assemblies.
- Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design.
- Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams.
- Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.
- Investigate machine problems and implement practical design improvements.
- Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost.
- Maintain proper engineering documentation and design-change records.
Requirements:
- Diploma or bachelor's degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline.
- Approximately 2 or more years of mechanical design experience in semiconductor equipment, precision automation, machine building, motion systems, or related industries.
- Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.
- Able to prepare detailed manufacturing and assembly drawings.
- Good understanding of: Fits and tolerances GD & T Bearings and linear-motion components Machining and fabrication processes Material selection and surface treatment Mechanical assembly and alignment
- Able to develop practical mechanism concepts rather than only produce drawings from instructions.
- Willing to support machine assembly, debugging, testing, and continuous improvement.
- Experience in semiconductor packaging or semiconductor automation equipment.
- Experience designing precision, high-stiffness, or thermally stable machine modules.
- Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.
- Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.
- Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.
- Experience taking a module from concept through assembly, testing, and customer acceptance.
- Familiarity with DFM, DFA, cost reduction, and engineering change control.
- Experience with prototype, customised, or first-of-a-kind equipment development.
