
Search by job, company or skills
Job Summary
You will support process engineering and sustaining activities for a European semiconductor material manufacturer, driving process optimization, troubleshooting, and continuous improvement to enable smooth mass manufacturing transitions and cost-effective operations.
Responsibilities
Preferred competencies and qualifications
Job ID: 151826889
Skills:
BI, Excel, Pareto control charts, basic scripting, Rca, Trend Analysis, Lean Six Sigma Green Belt, PFDs, Fmea
Skills:
Data Analysis, Advanced Packaging Process Development, Spc, FDC, advanced analytics tools, Metrology, Flip Chip Assembly, engineering principles, Thermo-Compression Bonding, Hybrid Bonding, AI automation, reliability data, process characterization, statistical methods, DOE methodologies
Skills:
3d packaging , process qualification , thermal management , Package Warpage, 2.5D Packaging, Advanced Packaging Process Development, Chiplets, Spc, CoPoS, Semiconductor Manufacturing Processes, Flip Chip Assembly, Manufacturing Engineering, Failure Analysis, Yield Improvement, Reliability Testing, CoWoS, HBM, Equipment Qualification, Alignment Accuracy, Large Die Packaging, Doe, Customer Process Development
Skills:
SAP, Microsoft Excel, GST accounting standards, Financial Controls
Skills:
design evaluation, DOE evaluations, plasma etch clean deposition systems, diagnostic test equipment, customer relations