Serve as the primary Equipment Owner and Subject Matter Expert (SME) for wafer bonding equipment within the Lithography (Photo) Department, ensuring best-in-class equipment performance, reliability, and manufacturing capability.
Lead the evaluation, selection, qualification, and deployment of new equipment, technologies, and capital investments to support business growth and technology roadmap requirements.
Drive equipment strategy, lifecycle management, and continuous improvement initiatives to achieve operational excellence in yield, uptime, throughput, and cost efficiency.
Lead equipment installation, qualification, conversion, transfer, upgrades, and sustaining activities for wafer bonders, Gemini bonders, SAM Coat, and associated process equipment.
Establish long-term reliability improvement plans by analyzing equipment performance, identifying chronic issues, and implementing sustainable corrective and preventive actions.
Partner with process, manufacturing, quality, facilities, and global engineering teams to resolve complex technical challenges affecting production and customer commitments.
Manage and drive equipment vendors to achieve performance targets related to uptime, MTTR, MTBF, OEE, spare parts management, and service responsiveness.
Lead cross-functional projects focused on yield enhancement, cycle-time reduction, defect reduction, capacity expansion, cost optimization, and automation implementation.
Utilize SPC, FDC, equipment intelligence, and advanced data analytics to identify opportunities for process and equipment optimization.
Champion alarm reduction, equipment robustness, predictive maintenance, and Industry 4.0 initiatives through machine control and data-driven methodologies.
Develop and standardize best practices, maintenance strategies, troubleshooting methodologies, OCAPs, and engineering procedures across the department.
Act as technical lead during critical tool excursions, ensuring effective root cause analysis and timely recovery plans.
Mentor and coach engineers, technicians, and production personnel to strengthen technical competencies and troubleshooting capabilities.
Provide technical leadership during NPI, process transfer, customer qualification, and manufacturing scale-up activities.
Drive a culture of continuous improvement, operational discipline, and engineering excellence across the Photo Department.
Job Requirements:
Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Microelectronics Engineering, or related Engineering discipline.
Minimum 3 years of semiconductor equipment or process engineering experience, preferably in Lithography/Photo, Advanced Packaging, or Wafer Bonding operations.
Hands-on experience with Wafer Bonders, Gemini Bonders, SAM Coat equipment.
Strong knowledge of equipment troubleshooting, process optimization, equipment qualification, and production support in a high-volume manufacturing environment.
Experience in developing, implementing, and sustaining preventive and predictive maintenance strategies to maximize equipment uptime and performance.
Ability to execute equipment upgrades, hardware modifications, and continuous improvement projects to enhance reliability, capability, and operational efficiency.
Strong analytical and logical thinking skills with a proven track record of driving effective problem resolution.
Excellent communication, interpersonal, and stakeholder management skills.
Willing to work Normal Shift, Swing Shift, or 12-hour rotating shift when required.
