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Job ID: 152400231
Skills:
cmp , Etching, process integration, lithography, deposition, Metrology, wafer fabrication, optical microscopy, yield improvement, defect analysis, Sem, root-cause analysis
Skills:
Statistical Analysis, wire bonding processes, Fmea, Spc, failure-analysis techniques, Doe, NPI process qualification, bond pull shear testing, Root Cause Analysis
Skills:
cmo management , Quality Assurance, Yield engineering, Wafer fabrication, FDA-regulated environment, Process Control, Test plans for components materials and systems, process integration, Analytical Problem Solving, Product Engineering, Project Management, Biochemistry process, Failure Analysis, Manufacturing processes methodologies, Back-end packaging assembly, Continuous Improvement
Skills:
Quality Assurance, process integration, Yield engineering, Product Engineering, Failure Analysis, Manufacturing processes methodologies, Engineering tools and software packages, Process Control, Continuous Improvement
Skills:
Utility Management, Electrical Engineering, Quality Control, Facilities Management