Senior Engineer/ Staff Engineer

Api, Molding, Fda, ISO/IEC 17799, qsr, engineering support, Design Management, Liase With Engineers, Manufacturing, Mechanical Engineering, Iso-13485, Medical Device Regulations

Quality tools such as FMEA and 8D, Module testing process, DFQ, Customer Management, DFX, Module packaging process, Failure Analysis, Validation, Reliability, Qualification

transistors , Pds, Reliability, quality tools such as FMEA, LEDs, operating principles of diodes, 8D, DFQ, ASICs, Product Quality, semiconductor backend processes, DFX, module packaging, quality issue resolution, Validation, Product Engineering, Customer Management, Qualification, semiconductor device physics, module testing process, advanced product quality, VCSELs, Customer Quality Management, Failure Analysis, Reliability Failure Analysis

finite element simulation, Jmp, plasma cleaning, Flip Chip process, Fmea, reflow, Minitab, structured 8D problem-solving, TCB NCP flux-less flow, pick place, SPC controls, flux engineering, underfill curing

Predictive Analytics, Test Engineering, defect density modelling, ATE platforms, yield learning, Design Verification, RTL, anomaly detection, system debug, semiconductor experience, Dft, ATE development, Product Development, EDA Tools, architecture, silicon bring-up, parametric analysis, yield engineering, characterization, OSAT test operations, AI solutions, adaptive test