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Senior/Staff Process Engineer (Flip Chip)

lumilens
5-7 Years
Singapore
  • Posted 26 days ago
  • Be among the first 10 applicants

Job Description

Core Responsibilities

  • Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
  • DOE to characterize process window and margin. Optimize process integration with upstream processes (e.g. bump/FO) to increase yield and manufacturability.
  • Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including NCP, flux, underfill etc, as applicable.
  • Design and execute DOE plans to characterize thermal and mechanical stress. Lead reliability validations including Temperature Cycling Test (TCT), Unbiased Highly Accelerated Stress Test (HAST) and High-Temperature Storage (HTS).
  • Failure Analysis & Debug: Own the root-cause diagnostics of structural failure modes unique to FC (e.g. flux void, residue, misalignment, die warpage, reflow anomaly, underfill void etc), and formulate improvement solutions.
  • Manage incoming material quality control, establish SPC control plans and monitor process variation to ensure long-term process stability.
  • Compile process SOP, WI, process failure reports and engineering change documents; support NPI new product introduction and process verification.

Key Requirements & Qualifications

  • Education: Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline.
  • Experience: 5+ years of hands-on industry experience in flip chip assembly.
  • Technical Knowledge:
  • Deep practical understanding of plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow.
  • Comprehensive command of finite element simulation principles regarding warpage, thermal dissipation, and structural mechanical integrity.
  • Solid working expertise with industry validation methodologies including FMEA, SPC controls, and structured 8D problem-solving tools.
  • Software Tools: High proficiency with robust analytical platforms like JMP, Minitab.

More Info

Job Type:
Permanent Job
Industry:
Other
Function:
Microelectronics
Employment Type:
Full time

About Company

Job ID: 152134389

Last Updated: 23-08-2026 10:22:29 PM
Homejobs in SingaporeSenior/Staff Process Engineer (Flip Chip)

Similar Jobs

Senior/Staff Process Engineer-Flip Chip

lumilens
Singapore

Skills:

finite element simulation, Jmp, plasma cleaning, Flip Chip process, Fmea, reflow, Minitab, structured 8D problem-solving, TCB NCP flux-less flow, pick place, SPC controls, flux engineering, underfill curing

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