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Job ID: 115966367
Skills:
laser marking , ocap, semiconductor assembly manufacturing, Laser Groove, Fmea, Spc, work instructions, pre-assembly processes, Wafer Dicing, Control Plan, Process Engineering, Process Specification, Backgrind, Doe
Skills:
Solidworks, Process Capability Analysis Cp Cpk, Wire Bond Process Development, Root Cause Analysis, Process Validation, Autocad, Technical Report Writing, Machine Programming, Pfmea, Die Bond Process Development, Statistical Process Control SPC, Design of Experiments DOE
Skills:
manufacturing processes , SAP, Microsoft Office, Jira, Project Engineering, Engineering Drawings, Assembly operations, Manufacturing Engineering, Tooling, MS Project, Mechanical Engineering, Mechanical components, Industrial manufacturing
Skills:
scientific moulding, RJG or equivalent Scientific Moulding certification, Injection Moulding, Root Cause Analysis
Skills:
SAP, Microsoft Office, Jira, Project Management, Microsoft Project