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Physical Design Lead

Physical Design Lead

Mirafra Technologies
5-7 Years
Not Disclosed
Early Applicant
  • Posted a month ago
  • Be among the first 10 applicants

Job Description

We are looking for an experienced Physical Design / SoC Full-Chip Technical Lead to drive the execution, methodology, and physical closure of complex next-generation SoC designs across advanced technology nodes, including 7nm, 5nm, 3nm, and beyond.

This role offers the opportunity to lead technically challenging full-chip implementations, collaborate closely with architecture and design teams, and own the physical implementation journey from RTL/Netlist to GDSII and tape-out.

Key Responsibilities

Technical Leadership & Full-Chip Ownership

  • Lead end-to-end physical implementation of complex SoCs and large sub-systems from RTL/Netlist through GDSII and tape-out.
  • Provide technical leadership and mentorship to the Physical Design team.
  • Drive execution, schedules, methodologies, and technical deliverables across the full-chip implementation flow.
  • Partner with Architecture, RTL, DFT, STA, Power, Signal Integrity, Packaging, and Verification teams to resolve complex design challenges.

What We're Looking For

  • Strong experience in full-chip Physical Design / Physical Implementation of complex SoCs.
  • Proven experience working on advanced process nodes such as 7nm, 5nm, 3nm, or below.
  • Strong understanding of the complete RTL-to-GDSII flow.
  • Hands-on expertise in Floorplanning, Synthesis, Placement, CTS, Routing, STA, SI, DRC/LVS, and EM/IR.
  • Experience with hierarchical designs, large SoCs, complex power domains, and challenging timing closure.
  • Strong problem-solving and technical leadership skills.
  • Ability to work effectively across multiple engineering disciplines and drive issues to closure.
  • Experience mentoring engineers and leading technical execution across complex projects.

Why Join Us

  • Work on next-generation SoCs using advanced semiconductor process technologies.
  • Solve challenging problems across physical implementation, timing, power, and signal integrity.
  • Work with highly experienced cross-functional engineering teams.
  • Opportunity to influence physical design methodologies, automation, and execution strategy.
  • Play a key role in delivering complex designs from concept to successful tape-out.

More Info

Job Type:
Industry:
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Key Skills

CTS

EM

Physical Implementation

DRC

RTL Netlist

Tape-out

Power Domains

GDSII

Hierarchical Designs

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