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You will own assigned process equipment end-to-end in a high-volume semiconductor fab, with direct accountability for uptime, reliability, and continuous improvement. The role suits an engineer who goes beyond reactive maintenance and drives structured problem-solving at the source.
Responsibilities
Requirements
Job ID: 150793443
Skills:
5 Why, Fmea, Spc, FDC, Fishbone, LAM Rainbow, LAM XLE, 8D
Skills:
Software Troubleshooting, leak detection, particle contamination analysis, Preventive Maintenance, Fmea, semiconductor manufacturing equipment, Spc, 8D, RF Systems, Rca, Lean Manufacturing, Six Sigma, vacuum systems, equipment reliability
Skills:
Software Troubleshooting, leak detection, particle contamination analysis, Preventive Maintenance, Fmea, semiconductor manufacturing equipment, Spc, 8D, RF Systems, Rca, Lean Manufacturing, Six Sigma, vacuum systems, equipment reliability
Skills:
LAM Sabre Cu Plating, Risk Assessment, ishikawa, Root Cause tools, 8D, Thin film PVD, PVD Endura
Skills:
camstar , promis , Space, AMAT DPSM, DSTI, Spc, Mes, ASPEN systems, DC OP, Jmp